Environmental awareness and energy efficiency are playing an increasingly important role in soldering technology. One aspect of this is that we can reduce the soldering temperature, all while maintaining the same soldering properties as standard SnAgCu alloys that can be used at 240 – 260 degrees.

Metalloglobus Fémöntő Kft. launched research to solve this problem in a way that also keeps cost-effectiveness in mind. For this reason, manganese and bismuth are added to low-silver solder and their effects on alloys are examined. In response to our joint tender with the Technical University of Budapest, the company won the VEKOP 2.1.7-15-2016 grant (Application document), and the project was successfully completed in December 2018.